MediaTek has rolled out its latest flagship smartphone chipset, the Dimensity 9400, marking the fourth entry in the company’s premier mobile SoC lineup. Designed for edge-AI applications, immersive gaming, and advanced photography, the Dimensity 9400 brings notable improvements in performance and efficiency.
Crafted using TSMC’s second-generation 3nm process, the Dimensity 9400 features MediaTek’s second-generation All Big Core design. It includes a single Arm Cortex-X925 core running at 3.62GHz, paired with three Cortex-X4 and four Cortex-A720 cores. This setup delivers a 35% increase in single-core performance and a 28% boost in multi-core performance compared to the Dimensity 9300. Additionally, the chipset is up to 40% more power-efficient, meaning your phone can last longer between charges—no more hunting for the nearest power outlet during a long day out.
Joe Chen, President at MediaTek, shared, “The MediaTek Dimensity 9400 will continue furthering our mission to be the enablers of AI, supporting powerful applications that anticipate users’ needs and adapt to their preferences, while also fueling generative AI technology with on-device LoRA training and video generation.” He emphasized that the Dimensity 9400 builds on MediaTek’s steady market growth and commitment to delivering top-tier performance in an efficient design.
One of the highlights of the Dimensity 9400 is MediaTek’s 8th Generation Neural Processing Unit (NPU), setting new standards with features like on-device LoRA training and high-quality video generation. The chipset supports Agentic AI, offering up to 80% faster large language model (LLM) prompt performance while maintaining a 35% improvement in power efficiency over the Dimensity 9300. It’s like having a smarter, more efficient brain inside your phone, minus the headaches.
Introducing the Dimensity Agentic AI Engine (DAE), the chipset turns traditional AI applications into sophisticated agentic AI solutions. By providing a unified interface for AI agents, third-party APKs, and models, MediaTek aims to streamline development and encourage a new ecosystem of agentic AI applications.
Gaming enthusiasts will appreciate the 12-core Arm Immortalis-G925 GPU, which delivers up to 40% faster ray tracing performance and a 41% boost in peak GPU performance, all while achieving up to 44% power savings compared to the Dimensity 9300. The chipset also supports HyperEngine technology for enhanced super resolution and picture quality, developed alongside Arm Accurate Super Resolution (Arm ASR). Gamers can enjoy longer sessions without worrying about their phone gasping for breath.
Photography and videography receive a boost with MediaTek Imagiq 1090, enabling HDR video recording across the entire zoom range and Smooth Zoom technology for capturing moving subjects. The Dimensity 9400 ensures efficient power usage, reducing power consumption by up to 14% during 4K60 video capture compared to the previous generation. Perfect for those moments when you need to capture the perfect selfie without draining your battery faster than a cat video goes viral.
Additional features of the Dimensity 9400 include:
- The latest 3GPP Release-17 5G modem, sporting 4CC-CA, rockets data speeds up to 7Gbps on sub-6GHz bands
- Meet the new 4nm Wi-Fi/Bluetooth combo chip: blazing 7.3Gbps data rates while sipping only half the power
- Extend your Wi-Fi playground with tri-band MLO and MediaTek Xtra Range 3.0, covering an extra 30 meters
- Dual SIM Dual Active and Dual Data let you juggle connections like a pro without breaking a sweat
- Tri-fold smartphone support gives designers the green light to dream up some seriously cool new shapes
Smartphones powered by the MediaTek Dimensity 9400 are expected to hit the market in the fourth quarter of 2024. For more information about MediaTek’s Dimensity portfolio, visit MediaTek Dimensity 9400.
