MediaTek Unveils Next-Gen Silicon: Dimensity CX C10 Max & 9600 Pro

MediaTek has expanded its high-performance silicon portfolio with the unveiling of three new system-on-chips (SoCs): the Dimensity CX C10 Max for PC-class computing, and the Dimensity 9600 Pro alongside the Dimensity 9600M for next-generation mobile devices. The announcements showcase the chipmaker’s push into advanced process nodes, agentic AI architecture, and cross-platform compute efficiency.

Dimensity CX C10 Max: Redefining Ultra-Portable Computing

Marking the debut of the Dimensity Compute Experiences (CX) line, the flagship Dimensity CX C10 Max is engineered specifically for premium, fanless, ultra-portable Googlebook hardware. Manufactured using TSMC’s 3nm process, the processor balances multi-day responsiveness with low thermal output.

• Architecture & CPU: Built on an All Big Core octa-core CPU design paired with an 11-core GPU to manage heavy multitasking, content creation, and productivity workloads without active cooling requirements.
• Artificial Intelligence: Houses the 8th-generation MediaTek NPU 890, delivering up to 55 TOPS of local processing power. Optimized for Gemini Intelligence, the NPU handles complex, low-latency AI routines on-device, improving user privacy and operational speed.
• Media & Imaging: Integrates the Imagiq 1090 AI-ISP, supporting image sensors up to 32MP. Key camera capabilities include hardware-accelerated HDR video, sustained autofocus, cinematic tracking, and optimized low-light processing for video conferencing.
• Next-Gen Connectivity: Features native Wi-Fi 7 integration with peak throughput up to 7.3Gbps, accompanied by dual-engine Bluetooth 6.0 for reduced peripheral latency and extended range.

Dimensity 9600 Series: Pushing the Limits of Mobile Silicon

Heading Mediatek’s flagship smartphone segment, the Dimensity 9600 Pro represents the industry’s first officially announced commercial SoC built on a 2nm process node. It centers heavily on a native “Agentic AI” framework designed to process contextual background tasks autonomously.

Key Architectural Highlights

• 2+3+3 All Big Core Design: Features two C2-Ultra cores clocked up to 4.55GHz, three C2-Pro cores at 4.35GHz, and three C2-Pro cores at 3.1GHz. This configuration delivers up to 17 percent higher single-core and 15 percent higher multi-core speeds while cutting multi-core power draw by 61 percent compared to the prior generation.
• Dual-NPU Architecture: Combines an ultra-low-power NPU (reducing always-on AI energy consumption by 40 percent) with the NPU 1090. The primary NPU yields a 51 percent uplift in LLM prefill performance, a 55 percent improvement in tokens-per-watt efficiency, and native support for on-device models up to 30 billion parameters.
• Memory & Fusion Architecture: Introduces native support for LPDDR6 memory and UFS 5.0 storage, backed by a 34.5MB cache. The AI Computing Fusion Architecture dynamically links CPU and NPU resources via an updated Dimensity Scheduling Engine.
• G2-Ultra NX Graphics: Delivers 27 percent higher peak GPU throughput, 18 percent faster hardware raytracing, and up to 185fps frame rates. MediaTek’s Neural Graphics Architecture works alongside HyperEngine optimizations to combine rendering and neural processing.
• Imagiq 1290 ISP: Fuses ISP and NPU processing to support 4K 240fps direct-output ultra-slow-motion capture, NPU-driven 60fps motion tracking, 17EV dynamic range, 4K 60fps AI True Color Tone, and 4K 120fps cinematic log recording.

Dimensity 9600M

Designed to bring flagship performance features to a broader segment of high-end mobile devices, the Dimensity 9600M incorporates the same core Agentic AI Engine, Dimensity Scheduling Engine, and HyperEngine gaming optimizations found in the Pro model. It provides native support for real-time AI image processing, high-frame-rate rendering up to 185fps, and always-on perceptual computing without compromising battery efficiency.

Platform Comparison

First commercial devices powered by the Dimensity 9600 Pro and Dimensity 9600M are scheduled to enter the market this quarter, with initial Dimensity CX C10 Max devices expected to roll out in upcoming hardware cycles.